Contents

Footnotes and figures -
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Please note, only the first four chapters are available as of Decmber 9.98. To be continued.
I. Introduction
II. The Scope of Ceramic Joining
III.The Importance of Residual Stresses
III.1 Mechanical Behaviour of Adhesive Joints
III.2 Fractography of Joints
IV. Common Joining Methods
IV.1 Design Considerations
IV.2 Glass Adhesives
Non-oxide ceramics
Crystallization Toughening
IV.3 Diffusion Bonding
Remarks
V. Treatments Increasing Surface Reactivity
VI. Other Joining Methods
VI.1 Ceramic Processing Techniques
VI.2 Liquid Phase and Eutectic Joining
VII. Emerging Joining Methods
VII.1 Electric Welding and Joining
VII.2 Chemical and Physical Deposition
VII.3 Liquid Metal Transfer
VII.4 Plasma Sprying
VII.5 Ultrasonic Joining
VII.6 Microwave Joining
VIII At the Frontiers
VIII.1 Micromachining and Mechanical Adhesion
VIII.2 Cold Welding
IX. Solid State Adhesion
X. Discussion
XI. Summary

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Introduction
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© Wieslaw A. Zdaniewski 1998
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