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Joining Technology for Advanced Ceramics
Perspectives, Problems and Opportunities.

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Chapter IV
 

 COMMON JOINING METHODS 




(2) Glass Adhesives.


GLASSES are in many respects ideal adhesives. They wet ceramics, allow a wide working temperature range, dissolve impurities and the extensive collection of silicate phase equilibria in the literature allows reactions to be predicted. Glasses can be applied as fine powders (in slips), by means of sputtering, glazing or as thin solid sheets. Glass joints can also be molded by vacuum or pressure
application [26].
    On the other hand, the usefulness of glasses for high T applications is limited by the relatively low glass transformation point, which for most glass compositions is lower than the temperature of creep onset in crystalline ceramics, and by low fracture toughness, Table II. There are other incentives, however, for considering glasses as adhesives, perhaps the most important being that intergranular phases in polycrystalline ceramics are often amorphous. Therefore an ideal glass dhesive should mimic the composition of the intergranular phase of the adherend. Unfortunately, this composition is rarely known, and its quantitative determination is difficult. Other glasses, not identical with it, have to be used as substitutes.
    Typically, joining is carried out at temperatures well above the Tg point of glass, with or without applied pressure, in circumstances where the glass wets and joins opposing surfaces. This is followed by relaxation annealing. The feasibility of this approach has been proved [7]. Namely, simple butt joints wih rectangular cross sections were prepared at elevated T, using various glasses. The reactions at the cearamic/glass interface were minimized by short heat treatment times. The mechanical behavior of such joints was then evaluated in terms of stress disrtibutions, fracture toughness and strength.
    Thermal expansion mismatch between the adhesive and adherends was one of the variables to be controlled. The Young's moduli of the adherends (alumina) and glass adhesives were 350 and 65 GPa respectively. The coefficient of thermal expansion was 7.2 x 10-6 ºC-1 for the ceramic and from 3.5 to 11.1 x 10-6 ºC-1 for the seven glass compositions used [7]. The concept of the model is generic, and is used here to illustrate the imoortant influence of residual stresses on the mechanical properties of the joints.
    The distribution of residual stresses calculated by finite element analysis is shown in Fig.8. Stress profiles indicate the presence of stress concentrations at free surfaces and at the adhesive/adherend interfaces. The shear stresses at the interface are the principal means for the stress transfer induced by thermal strain. The sign of the shear stress and of the axial stress sx, depends on the sign of the difference in the thermal expansion (Æa) and elastic mismatch (ÆE) between the adhesive and adherend:

Æe = ÆT. Æa . ÆE

Obviously, presence of residual stresses in the joints subjected to external loadings must have profound effect on durablity of the joints. Because stress intensity factors due to applied and residual loads are additive, the presence of surface flaws is less admissible in joints than it is in homogeneous ceramics. For more details see Ref.7.    The variation of the apparent fracture toughness with the thermal expansion mismatch is plotted in Fig.9. The highest average KIc value was ~ 2 MPa m1/2 measured for joints formed with glass which most closely matched the coefficient of thermal expansion ofthe adherend. In addition, the flexural strength showed that the strongest adhesive/adherend combinations were, those that had the smallest value of Æe, and therefore the lowest residual stresses. In a parallel experiment, thickness of the adhesive Iayer was varied for a constant Æe. The results showed that to minimize the absolute values of both shear and axial sx stresses, joints with a minimum thickness are preferable. Because of the limitations of the finite element code (Bopac) used, the present analysis covered thicknesses from 1.3 to 0.1 mm, only [7].
    Extension of these results to constrained layers > lOOum, and eventually >1 um thick is desirable for improved understindig of the principles of interfacial and grain boundary adhesion in polycrystalline materials and joints.



Å To be continued Å

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